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  maf00037aem mn103sh6 series type MN103SFH6K internal rom type flash rom (byte) 256k ram (byte) 12k package (lead-free) ubga128-p-0707ae minimum instruction execution time 25 ns (2.2 v to 5.5 v) ? interrupts 8 external interrupts 68 internal interrupts: watchdog timer. timer. 16 -bit timer expansion pwm ?nish. serial i/f. a/d conversion ?nish. dma. system error ? timer counter 8-bit timer 8 timer 0 to 7 ........... interval timer. event count. cascading connectable (usable as 16-bit, 24-bit and 32-bit counter) 16-bit timer 8 timer c 0 to c5 ...... interval timer. event count. input capture. pwm output (cycle and pulse width variable) timer c 6, c7 ......... interval timer. event count. input capture. pwm output (cycle and pulse width variable). expansion pwm output ? serial interface multi-master i 2 c/synchronous interface selective 2 uart (full duplex) /synchronous interfaces selective 3 ? dma controller number of channels: 4 channels ? i/o pins i/o 82 : common use 82 ? a/d converter (10-bit resolution 9 channels) 2 unit minimum conversion time: 1.3 s simultaneous conversion of 2 unit are available conversion start synchronized with timer 1, 3, c0, c1 or pwm for motor automatic control (pid) are available ? d/a converter (8-bit resolution 1 channel) 6 unit ? motor control pwm pwm for motor automatic control (pid) 3 pid operation and motor control pwm output (operation parameter and pwm parameter adjustments possible) ? electrical charactreistics (a/d converter characteristics) parameter symbol condition limit unit min typ max non-linear error vdd5 = 5.0 v. vss = 0 v vref+ = 5.0 v. tad = 100 ns 3 lsb differential non-linearity error 3 lsb a/d conversion time 1.3 s analog input voltage vss vref+ v
maf00037aem MN103SFH6K ? pin assignment ubga128-p-0707ae a b c e g j l 12 n.c. n.c. p62, tmc4bio p60, tmc3bio, irq7 p56, tmc2bio pa 1, irq6 p53, tmc7ep3 , tmc7di o p51, tmc7ep1 , tmc7bi o p45, tmc6ep1 , tmc6bi o p43, pidbnz, pidpwm z p37, pidbny , pidpwm x n.c. 12 11 p65, dacout0 p67, dacout2 p64, tmc5bio p63, tmc5aio p57, tmc3aio p55, tmc2aio p52, tmc7ep2, tmc7ci o p46, tmc6ep2, tmc6ci o p42, pidbpz, piddir z p40, pidapz, piddir y, tmc1ai o n.c. p36, pidbpy , piddirx 11 10 p70, dacout3 p71, dacout4 p66, dacout1 p61, tmc4aio vdd1 8 p54, clkout p50, tmc7ep0 , tmc7ai o p47, tmc6ep3, tmc6di o p41, pidanz , pidpwm y, tmc1bi o p34, pidapy , pidfwd z p35, pidany , pidrevz p33, pidbnx , pidrevy 10 9 vs s p73, irq0 p72, dacout5 n.c. n.c. n.c. vs s p44, tmc6ep0 , tmc6ai o n.c. p30, pidapx , pidfwdx , sbi 4 p32, pidbp x , pidfwdy , sbt 4 p31, pidanx , pidrev x , sbo 4 9 8 vs s vdd 5 vdd 5 n.c. n.c. p27, irq 5 vdd5 vs s 8 7 p75, adin01 p76, adin02 p74, adin00 n.c. n.c. vdd5 vs s vdd 5 7 6 p77, adin03 p81, adin05 p80, adin04 n.c. n.c. p24, sbo 3 p26, irq 4 p25, sbt3 6 5 p82, adin06 p84, adin08 p83, adin07 n.c. n.c. p21, sbo 2 p23, sbi 3 p22, sbt2 5 4 4 3 3 2 2 1 1 p85, irq1 vr ef1+ v ref0+ n.c. p97, irq2 vss n.c. n.c. n.c. p16, sbo 1 p20, sbi 2 p17, sbt1 p86, adin10 p90, adin12 p87, adin 11 p93, adin15 sda ta , test2 test3 p00, tm0io p03, tm3io p13, sbo 0 p12, sbi 0 p15, sbi 1 p14, sbt0 p91, adin13 n.c. p94, adin16 p95, adin17 sclock, test1 osco vppe x p02, tm2io p05, tm5io p06, tm6io p10, tmc0ai o p1 1, tmc0bi o n.c. p92, adin14 p96, adin18 pa 0, irq3 vdd1 8 o sc i vdd 5 nrs t p01, tm1io p04, tm4io p07, tm7i o n.c. d f h k m a b c e g j l d f h k m
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805


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